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[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || PrefaceLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Polyimide HydrolysisLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Subject IndexLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Author IndexLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Conduction Transients in PolyimidesLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Electrophoretic Deposition of PolyimidesLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Polyimides for Dielectric LayersLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || New Transfer Molding CompoundsLupinski, John H.; Moore, Robert S. · 1989