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Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment

Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment

Ali, Bakhtiar; Sabri, Mohd Faizul Mohd; Said, Suhana Mohd; Sukiman, Nazatul Liana; Jauhari, Iswadi; Mahdavifard, Mohammad Hossein
  • 期刊名称Microelectronics Reliability
  • 作者Ali, Bakhtiar; Sabri, Mohd Faizul Mohd; Said, Suhana Mohd; Sukiman, Nazatul Liana; Jauhari, Iswadi; Mahdavifard, Mohammad Hossein
  • 卷第82卷
  • 印刷ISSN0026-2714
  • 文件大小1140.64KB
  • 发表时间2018-03
  • DOI10.1016/j.microrel.2018.01.015
  • 页码171-178
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