Relationship between the thermal stress and structures of thermal-cycling-induced cracks in electroless nickel plating on metalized substrates
Fukuda, Shinji; Shimada, Kazuhiko; Izu, Noriya; Miyazaki, Hiroyuki; Iwakiri, Shoji; Hirao, Kiyoshi
- 期刊名称Journal of Materials Science: Materials in Electronics
- 作者Fukuda, Shinji; Shimada, Kazuhiko; Izu, Noriya; Miyazaki, Hiroyuki; Iwakiri, Shoji; Hirao, Kiyoshi
- 印刷ISSN0957-4522
- 电子ISSN1573-482X
- 文件大小14152.88KB
- 发表时间2019-2-19
- DOI10.1007/s10854-019-00880-6