When is a project successful?
- 期刊名称IEEE Engineering Management Review
- 作者Meredith, Jack; Zwikael, Ofer
- 印刷ISSN0360-8581
- 电子ISSN1937-4178
- 文件大小198.43KB
- 发表时间2019
- DOI10.1109/EMR.2019.2928961
- 页码1-1
[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Index2019
[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Dynamic weighted average in multisensory systemsRivera Velazquez, Josue Manuel; Mailly, Frederick; Nouet, Pascal · 2019
[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Design of a Micropump Based on an Industrial Microphone Manufacturing ProcessSeidl, Martin; Schrag, Gabriele; Klein, Wolfgang; Vobl, Matthias; Krumbein, Ulrich · 2019
[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - EMBG Magnetostatic Wave Band Stop ResonatorsCismaru, Alina; Aldrigo, Martino; Iordanescu, Sergiu; Parvulescu, Catalin; Proietti, Emanuela; Sardi, Giovanni; Marcelli, Romolo · 2019
[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Investigations of Aluminum Nitride based piezoelectric MEMSStiebing, Martin; Tavakolibasti, Majid; Stoeckel, Chris; Hiller, Karla; Wunderle, Bernhard · 2019
[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - CFD modelling of magnetic nanoparticle suspension in microfluidicsPalovics, Peter; Nemeth, Marton; Rencz, Marta · 2019
[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - FEM Modeling and experimental testing of notched MEMS specimenAurelio, Soma · 2019
[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - MEMS calorimetric shear-stress sensor based on flexible substrateChamard, Leo; Giani, Alain; Combette, Philippe; Weiss, Julien · 2019