[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - PCB Integrated Inductor Design Optimized and Electrical Performance Analysis for Power Module Development
- 作者Yang, Shu-Ting; Chiang, Chi-Hao; Hsieh, Yu-Chang; Lee, Pao-Nan; Wang, Chen-Chao
- 文件大小837.23KB
- 发表时间2019
- DOI10.1109/edaps47854.2019.9011673
- 页码1-3
[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - EDAPS 2019 Committees2019
[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - EDAPS 2019 Opening2019
[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - EDAPS 2019 Opening2019
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[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - PCB Integrated Inductor Design Optimized and Electrical Performance Analysis for Power Module DevelopmentYang, Shu-Ting; Chiang, Chi-Hao; Hsieh, Yu-Chang; Lee, Pao-Nan; Wang, Chen-Chao · 2019