![[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Fast Physical Verification for 16nm Package Electrical Performance]()
[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Fast Physical Verification for 16nm Package Electrical PerformanceShi, Hong; Lee, Chao-Chin; Chu, Chia-Hui; Chiou, Shian-Min; Chiu, Po-Wei; Leung, Dennis · 2019