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[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1994.05.1-1994.05.4)] 1994 Proceedings 44th Electronic Components and Technology Conference ECTC-94 - 1994 Proceedings. 44th Electronic Components and Technology Conference1994
[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - KGD levels and effectsRates, J. · 1994
[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - Concurrent packaging architecture designCao, L.P.; Krusius, J.P. · 1994
[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - Electrical performance of microwave boardsTraut, G.R. · 1994
[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - Crosstalk driven routing adviceSengupta, M.; Lipa, S.; Franzon, P.; Steer, M. · 1994
[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - Connectorized optical fiber circuitsShahid, M.A.; Roll, R.A.; Shevchuk, G.J. · 1994
[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - Capacitance monitoring while flex testingBergenthal, J.; Prymak, J.D. · 1994
[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - Connectors-metallurgy meets modelingCribb, W.R.; Ratka, J.O. · 1994
Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologiesKromann, G.B. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1995
The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603 and PowerPC 604 RISC microprocessorsParry, J.; Rosten, H.; Kromann, G.B. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1998
Solder joint reliability of high I/O ceramic-ball-grid arrays and ceramic quad-flat-packs in computer environments: the PowerPC 603/sup TM/ and PowerPC 604/sup TM/ microprocessorsGerke, R.D.; Kromann, G.B. · IEEE Transactions on Components and Packaging Technologies · 1999
[IEEE Comput. Soc. Press 1992 IEEE Multi-Chip Module Conference MCMC-92 - Santa Cruz, CA, USA (18-20 March 1992)] Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 - Thermal management for ceramic multichip modules: experimental programKromann, G.B. · 1992
[IEEE 1997 47th Electronic Components and Technology Conference - San Jose, CA, USA (18-21 May 1997)] 1997 Proceedings 47th Electronic Components and Technology Conference - Investigation of heat sink attach methodologies and the effects on package structural integrity and interconnect reliability of the 119-lead plastic ball grid arrayEyman, L.M.; Kromann, G.B. · 1997
[IEEE Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings - Austin, TX, USA (5-7 March 1996)] Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings - Thermal management of a C4/ceramic-ball-grid array: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessorsKromann, G.B. · 1996
[IEEE 1996 46th Electronic Components and Technology Conference - Orlando, FL, USA (28-31 May 1996)] 1996 Proceedings 46th Electronic Components and Technology Conference - The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessorsParry, J.; Rosten, H.; Kromann, G.B. · 1996