[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologies
- 作者Kromann, G.B.
- 文件大小689.46KB
- 发表时间1994
- DOI10.1109/ectc.1994.367559
- 页码395-402
[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1994.05.1-1994.05.4)] 1994 Proceedings 44th Electronic Components and Technology Conference ECTC-94 - 1994 Proceedings. 44th Electronic Components and Technology Conference1994
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