海量图书期刊资源,随时随地畅享阅读乐趣
Deposition of Copper Thin Films on Titanium Nitride Layer Prepared by Flow Modulation CVD TechnologyCho, Nam Ihn; Kim, Min Chul; Rim, Kyung Hwa; Chang, Ho Jung; Jun, Keeyoung; Shimogaki, Yukihiro · Materials Science Forum · 2004
Improvement of TiN Flow Modulation Chemical Vapor Deposition from TiCl <sub/>4</sub> and NH <sub/>3</sub> by Introducing Ar Purge TimeJun, Keeyoung; Im, Ik-Tae; Shimogaki, Yukihiro · Japanese Journal of Applied Physics · 2004
Effect of Partial Pressure of TiCl <sub/>4</sub> and NH <sub/>3</sub> on Chemical Vapor Deposition Titanium Nitride (CVD-TiN) Film Cl Content and Electrical ResistivityJun, Keeyoung; Shimogaki, Yukihiro · Japanese Journal of Applied Physics · 2004
Kinetics of TiN Chemical Vapor Deposition Process using TiCl <sub/>4</sub> and NH <sub/>3</sub> for ULSI Diffusion Barrier Applications: Relationship between Step Coverage and NH <sub/>3</sub> Partial PressureJun, Keeyoung; Egashira, Yasuyuki; Shimogaki, Yukihiro · Japanese Journal of Applied Physics · 2004