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Mesomechanical modelling of SnAgCu solder joints in flip chipJicheng Gong; Changqing Liu; Paul P. Conway; Vadim V. Silberschmidt · 2008
Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu AlloyJicheng Gong; Paul P. Conway; Changqing Liu; Vadim V. Silberschmidt · 2009
Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrateJicheng Gong; Changqing Liu; Paul P. Conway; Vadim V. Silberschmidt · 2008
Formation of Sn dendrites and SnAg eutectics in a SnAgCu solderJicheng Gong; Changqing Liu; Paul P. Conway; Vadim V. Silberschmidt · 2009
Formation of Ag3Sn plates in SnAgCu solder bumpsJicheng Gong; Changqing Liu; Paul P. Conway; Vadim V. Silberschmidt · 2010
Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrateJicheng Gong; Changqing Liu; Paul P. Conway; Vadim V. Silberschmidt · 2009
Modelling of Ag3Sn coarsening and its effect on creep of Sn–Ag eutecticsJicheng Gong; Changqing Liu; Paul P. Conway; Vadim V. Silberschmidt · 2006