Editorial board
- 期刊名称International Journal of Thermal Sciences
- 卷第71卷
- 印刷ISSN1290-0729
- 文件大小97.34KB
- 发表时间2013-9
- DOI10.1016/S1290-0729(13)00127-0
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RF CMOS reliability simulationsSasse, Guido T.; Acar, Mustafa; Kuper, Fred G.; Schmitz, Jurriaan · Microelectronics Reliability · 2008
EditorialGroeseneken, Guido; Wolf, Ingrid De; Mouthaan, Anton; Bisschop, Jaap · Microelectronics Reliability · 2008
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Book ReviewNaikan, Vallayil N.A. · Microelectronics Reliability · 2013
Endurance behavior of conductive yarnsde Vries, Hans; Cherenack, Kunigunde H. · Microelectronics Reliability · 2014
Trends in automotive power semiconductor packagingDietrich, Peter · Microelectronics Reliability · 2013