Tools for ultrasonic hot embossing
- 期刊名称Microsystem Technologies
- 作者Liao, S.; Gerhardy, C.; Sackmann, J.; Schomburg, W. K.
- 卷第21卷
- 期第7期
- 印刷ISSN0946-7076
- 电子ISSN1432-1858
- 文件大小1628.22KB
- 发表时间2015-7
- DOI10.1007/s00542-014-2232-6
- 页码1533-1541
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ForewordBharat Bhushan · Microsystem Technologies · 2014
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