![[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor]()
[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensorAuersperg, J.; Auerswald, E.; Collet, C.; Dean, Th.; Vogel, D.; Winkler, Th.; Rzepka, S. · 2017