Retropatellare Denervierung
- 期刊名称Der Orthopäde
- 作者Handel, M.; Riedt, S.; Lechler, P.; Schaumburger, J.; Köck, F.X.; Sell, S.
- 卷第43卷
- 期第2期
- 印刷ISSN0085-4530
- 电子ISSN1433-0431
- 文件大小324.64KB
- 发表时间2014-02
- DOI10.1007/s00132-013-2247-1
- 页码143-147
[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Packaging Friendly Parallel Optical TransceiversWang, Xiaoqing; Kiamilev, Fouad; Papen, George; Ekman, Jeremy; Gui, Ping; Haney, Mike; Deroba, Joseph; McFadden, Michael; Kuznia, Charles · 2003
[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Tackling the Drop Impact Reliability of Electronic PackagingWong, E. H.; Lim, C. T.; Field, J. E.; Tan, V. B. C.; Shim, V. P. W.; Lim, K. M.; Seah, S. K. W. · 2003
[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Analysis of ACF Contact ResistanceConstable, J. H. · 2003
[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Deformation Characteristics of Solder JointsBastawros, Ashraf; Antoniou, Antonia · 2003
[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (Sunday 6 July 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 - Capacity Control in Refrigerated SystemsPeeples, Johnston W. · 2003
[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Vibration Fatigue Test of Surface Mount Electronic ComponentsWong, T. E.; Fenger, H. S. · 2003
[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (Sunday 6 July 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 - Heat Transfer in Triangular MicrochannelsDickey, J. Todd; Lam, Tung T. · 2003
[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (Sunday 6 July 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 - Performance Comparison of Mesoscale Refrigeration Technologies for Electronics PackagingPhelan, Patrick E.; Chiriac, Victor; Lee, Tien-Yu Tom · 2003