Acknowledgement of reviewers
- 期刊名称Environmental Fluid Mechanics
- 卷第16卷
- 期第2期
- 印刷ISSN1567-7419
- 电子ISSN1573-1510
- 文件大小78.16KB
- 发表时间2016-4-1
- DOI10.1007/s10652-016-9446-3
- 页码481-483
An idea of oscillating alphabets through mechanical couplingAshok, Akarapu; Kumar, P. Manoj; Pal, Prem; Pandey, Ashok Kumar · ISSS Journal of Micro and Smart Systems · 2018
Frequency analysis of hexagonal microbeam with 2D nanofiber matGangele, Aparna; Ashok, Akarapu; Sharma, Chandra Sekhar; Pal, Prem; Pandey, Ashok Kumar · Materials Research Express · 2019
Design and analysis of microcantilever beams based on arrow shapeAshok, Akarapu; Nighot, Rohit Prakash; Sahu, Nagesh Kumar; Pal, Prem; Pandey, Ashok Kumar · Microsystem Technologies · 2019
Achieving Wideband Micromechanical System using Coupled Non-Uniform Beams ArrayAshok, Akarapu; Kumar, P Manoj; Singh, Sajal Sagar; Raju, P; Pal, Prem; Pandey, Ashok Kumar · Sensors and Actuators A: Physical · 2018
An Analysis of Stepped Trapezoidal Shaped Microcantilever beams for MEMS based DevicesAkarapu, Ashok; Gangele, Aparna; Pal, Prem; Pandey, Ashok Kumar · Journal of Micromechanics and Microengineering · 2018
Experimental and Theoretical Analysis of Drag Forces in Micromechanical-Beam ArraysAkarapu, Ashok; Nighot, Rohit Prakash; Devsoth, Lalsingh; Yadav, Mukul; Pal, Prem; Pandey, Ashok Kumar · Physical Review Applied · 2020
Investigation of anodic silicon dioxide thin films for microelectromechanical systems applicationsPal, Prem; Ashok, Akarapu · Micro & Nano Letters · 2014
Anisotropic etching in low-concentration KOH: effects of surfactant concentrationXing, Yan; Haldar, Subhomoy; Sato, Kazuo; Ashok, Akarapu; Pal, Prem · Micro & Nano Letters · 2015
Optimization of MEMS capacitive accelerometerBenmessaoud, Mourad; Nasreddine, Mekkakia Maaza · Microsystem Technologies · 2013
Novel microstructured evaporation deviceWibel, Wolf; Maikowske, Stefan; Brandner, Juergen J. · Microsystem Technologies · 2015
HAMR HDD shock responsesHuang, Lidu; Suzuki, Kenzi; Huang, Fu-Ying; Hirano, Toshiki; Stipe, Barry · Microsystem Technologies · 2014
Tools for ultrasonic hot embossingLiao, S.; Gerhardy, C.; Sackmann, J.; Schomburg, W. K. · Microsystem Technologies · 2015
ForewordBharat Bhushan · Microsystem Technologies · 2014
Hybrid micro electrostatic actuatorHailu, Zewdu; He, Siyuan; Ben Mrad, Ridha · Microsystem Technologies · 2016
Special issue WaferBond’13Knechtel, Roy; Niklaus, Frank; Michel, Bernd · Microsystem Technologies · 2015
Editorial special issue HARMNST 2013Mohr, Jürgen; Göttert, Jost; Michel, Bernd · Microsystem Technologies · 2014